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ARGOTECH provides R&D and packaging services in the field of MICROELECTRONICS and OPTOELECTRONICS. Our R&D team is active in the field of SILICON PHOTONICS
Die bonding - soldering or epoxy fixation,flip chip,face up,components size from 150*150 μm,placement accuracy ± 1µm,wire bonding - ball-wedge,wedge-wedge,bsob,gold or aluminium wire from dia 17+μm,wafer probing (burn-in) - electrical,optical,spectrum measurement,bare die chips and optical diodes,optical coupling - butt & free space optics in active alignment mode,coupling lasers and pds,laser welding & adhesive fixation ,hermetic encapsulation - nitrogen and other gasses ,test & inspection from wafer level to components,and substrate dicing - (silicon,gaas,al2o3,aln,silica etc)
Argotech semiconductor photonics operates in the Appliances, electrical, and electronics manufacturing industry.
Argotech semiconductor photonics's revenue is 11m - 100m
Argotech semiconductor photonics has 11 - 50 employees.
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