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Boschman Advanced Packaging Technology, a solution driven company serving the semiconductor assembly industries worldwide Boschman Advanced Packaging Technology is an experienced and dynamic high-tech company serving the global semiconductor assembly industry providing quality solutions for specific market segments, Mems & Sensors, Smartcards and Powers. Boschman Advanced Packaging Technology is founded in 1990 and the head quarter is based in The Netherlands in a modern, well-equipped facility. Molding and Sinter Systems Our molding and Ag-Sinter systems are developed at our systems R&D facility in the Netherlands. Mechanical, electrical, software, process and mold/tool-design experts work in multi-disciplinary teams to realize the best...
Package development,ag sintering,transfer molding,mems & sensors,and power modules
Boschman advanced packaging technology operates in the Semiconductor manufacturing industry.
Boschman advanced packaging technology's revenue is 11m - 100m
Boschman advanced packaging technology has 51 - 200 employees.
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