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Mark J.
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Cressem is creative assembly solution provider for the Electronics manufacturing industry. Cressem provides Ultrasonic ACF bonding solution of the FOF(Flex On Flex), FOB and FOG assembly. It is the most advanced assembly technology for Display, TSP, Smart card, Wearable & Flexible device, mobile device and smart glass manufacturing business
Ultrasonic acf bonder,oca,ocr,underfill material,and packing material
Cressem operates in the Machinery manufacturing industry.
Cressem's revenue is 11m - 100m
Cressem has 11 - 50 employees.
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