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Mark J.
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Dynatex International has been the leader in dry process dicing and wafer dicing materials since 1958. We are committed to providing solutions for die/diode dicing and wafer processing applications -- solutions designed to increase yields, maximize throughput, and minimize operator intervention. With over five decades of experience, Dynatex International offers a strong base of technical accomplishment and business expertise to assist you with all your dicing needs
Complete line of wafer dicing materials and equipment,dynatex offers over 5 decades of technical dicing and engineering expertise,and complete line of dtx dicing equipment designed specifically for mems/die singulation and laser diode cleaving.
Dynatex international's HQ phone number is +7 075424227
Dynatex international's revenue is 11m - 100m
Dynatex international has 11 - 50 employees.
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