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FlipChip International (FCI) supplies turnkey semiconductor assembly and test services to the consumer, automotive, aerospace and medical industries through our leadership in high volume wafer level packaging and advanced packaging technologies. FCI was an early developer of Wafer-Level Chip Scale Packaging and remains the technology leader in this field with many patented technologies spanning from Cu Pillar Bumping, SpheronTM WLCSP, ChipsetTTM Embedded Die Packaging, and FlipChip on Leadframe assembly. FCI supports a wide range of customers from each industry, frequently partnering with them to engineer customized solutions. FCI has a global footprint, offering high volume advanced packaging services from ISO/TS...
Semiconductor wafer solder bumping (wlcsp),multi project wafers,semiconductor assembly and test,and backgrind,wafer saw,tape and reel,laser mark
Flipchip international operates in the Semiconductor manufacturing industry.
Flipchip international's HQ phone number is +1 602 431 4709
Flipchip international's revenue is 11m - 100m
Flipchip international has 51 - 200 employees.
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