Hesse Mechatronics, Inc

Hesse Mechatronics, Inc. (formerly Hesse & Knipps, Inc.) is the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for backend semiconductor assembly in the power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics industries. The company designs and manufactures high speed, fully automatic fine pitch thin wire bonders for aluminum and gold round wire and ribbon, and heavy wire bonders for aluminum, gold and copper round wire and ribbon, including HCRTM (High Current Ribbon). The companys product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems,...

Thin wire wedge bonders,wedge bonders,heavy wire wedge bonders,ribbon bonders,wire bonding equipment training,wedge bonding process support,wire bonding application development,pre-production manufacturing,and wire bonding prototypes

Hesse mechatronics, inc operates in the Semiconductors industry.

Hesse mechatronics, inc's revenue is 11m - 100m

Hesse mechatronics, inc has 11 - 50 employees.