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JCET Group is the worlds leading integrated-circuit manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. JCET Group has two R&D centers in China and Korea, six manufacturing locations in China, Korea, and Singapore, and sales centers around the...
Ic packaging,advanced packaging,wire bond,flip-chip,system-in-package,wafer level packaging,2.5d/3d packaging,xdfoi,ewlb,and wlcsp
Jcet group operates in the Semiconductor manufacturing industry.
Jcet group's revenue is 1b+
Jcet group has 201 - 500 employees.
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