JIACO Instruments

JIACO Instruments MIP decapsulation system is a breakthrough innovation: Automated atmospheric pressure Microwave-Induced-Plasma (MIP) decapsulation utilising O2-only recipes. The system has been proven for Cu, PdCu, Au, Ag bond wires and for advanced package types like 3D, SiP, WLCSP, BOAC; all without process induced damage for reliable failure analysis and quality control. Our application range includes: - HAST, HTS, TMCL stressed Cu, PdCu, Au, Ag wire packages - Silver wire packages (new) - Wafer Level Chip Scale Package (WLCSP) (new) - High Tg mold compound (new) - Film Over Wire (FOW) (new) - Chip on Board (new) - Electrical Overstress...

Plasma decapsulation systems,advanced ic package decapsulation,copper wire decapsulation,thermally stressed package decapsulation,led package decapsulation,3d stacked die package decapsulation,silver wire decapsulation,copper wire decapsulation,saw baw filter decapsulation,sip & module decapsulation,ag,cu,pdcu,au wire decapsulation,o2 only plasma decapsulation,eos exposure,and underfill ,fow,die attach etching

Jiaco instruments operates in the Semiconductors industry.

Jiaco instruments's revenue is 11m - 100m

Jiaco instruments has 11 - 50 employees.