NHanced Semiconductors, Inc

NHanced Semiconductors is pioneering the future of advanced chip packaging. Our deeply experienced team applies decades of semiconductor expertise to solve todays most pressing challenges. Led by industry veteran Bob Patti, we are spearheading next-generation architectures. We wield cutting-edge processes like 3D stacking, 2.5D interposers, high density interconnect, and chiplets to deliver brilliant solutions. We call it Foundry 2.0. Whether you require interposers, 2.5D assembly, TSV insertion, 3D stacking, or mixed-material integration, weve got you covered. Our fabs provide in-house process R&D, prototype fabrication, and small- to mid-volume manufacturing. With more than 70 advanced materials to work with and strong...

Advanced packing,beol processing,3d and 2.5d integration,interposer/chiplet designs,prototyping,wafer-level and die-level stacking and thinning,2.5/3d design support,custom silicon interposers,r&d services,concept to prototype,small to mid-volume manufacturing,process development,iii-v and other exotic materials,photonics,micro transfer printing,and high density interconnect (hdi)

Nhanced semiconductors, inc operates in the Semiconductor manufacturing industry.

Nhanced semiconductors, inc's revenue is 11m - 100m

Nhanced semiconductors, inc has 51 - 200 employees.