PacTech - Packaging Technologies

Advanced equipment manufacturer, wafer level packaging (WLP) subcontracting service provider and chemistry supplier specialized in electroless under bump metallization (UBM), solder balling and back-end services with more than 25 years of experience after spinning off from the Fraunhofer Institute for Reliability and Microintegration IZM in Berlin, Germany. Mother company: Nagase & Co., Ltd. with headquarters in Tokyo, Japan Facilities: Nauen, Germany (headquarters), Santa Clara, CA, USA & Penang, Malaysia

Mikroelektronik,solder ball jetting,laser assisted bonding,wafer level packaging,gang ball placement,prototyping services,electroless-ni/au plating,solder bumping,backend assembly,wafer level solder balling,wafer dicing,wafer sawing,solder deballing,solder reballing,robot soldering,wafer level ubm plating,spin coating,solder ball rework,pin bonding,3d packaging,3.5d multilayer die stacking,selective chip rework,electroplating,wlp,flip chip,and smt

Pactech - packaging technologies operates in the Semiconductor manufacturing industry.

Pactech - packaging technologies's revenue is 11m - 100m

Pactech - packaging technologies has 51 - 200 employees.