Pantronix Corporation

Pantronix, since 1974 has been the U.S. leader in providing Advanced Packaging & Testing as well as Microelectronics Assembly to Global Customers in a wide range of industries. Located in a 90,000 sq ft ISO 9001:2008 and ISO 13485:2003 Certified Facility in Fremont California. Pantronix Corporation directly serves the Military, Aerospace, Medical, Communications, Computer and Consumer markets. The Component Division provides a full range of Advanced Semiconductor and Photonic Device Packaging, Assembly and Testing Services. Our Assembly Capabilities include HiRel Packages, Multi -Chip Modules ( MCM ) Chip On Board ( COB ) Chip On Flex ( COF ) Custom Packages, Plastic Molded Packages, and Photonic Packages, Wire Bonding Services include, Aluminum Wedge, Gold Wedge, Gold Ball Wire Bonding. Custom Wire Bonding Solutions. Flip Chip capability. Our Test Services include Final Electrical Tests and various Reliability Tests. Facilities include Class 100, Class 10,000 clean rooms. Inter...