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QP Technologies (formerly Quik-Pak), a division of Promex Industries, specializes in IC packaging and assembly services, as well as wafer preparation and custom substrates. We offer packaging and assembly processes that help quickly bring your design to market. QP Technologies capabilities include packaging and assembly for prototype through high volume production. Broad range of package types including Open-molded Plastic Packaging (OmPP), Open Cavity Plastic Packaging (OCPP) and over-molded QFNs Custom-molded QFN packages available in high volume Die/wire bonding, encapsulation, and marking/branding Assembly services for flip chip, ceramic packages, chip-on-board, stacked die, and MEMS Wafer preparation services - dicing, back grinding,...
Ic packaging,ic assembly,microelectronic packaging,assembly solutions,wafer preparation,and substrate development
Qp technologies operates in the Semiconductor manufacturing industry.
Qp technologies's revenue is 11m - 100m
Qp technologies has 11 - 50 employees.
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