Siltectra GmbH

SILTECTRA is specialized in wafer treatment technologies. Based on research made at Harvard the company developed the patented Cold Split process, an innovative new technology applicable for kerf-free wafering and thinning of wafers or other thin substrates made of brittle materials. The PV industry uses Cold Split for cost savings in cell manufacturing while silicon wafers can be manufactured without losing precious material during wire-sawing. The compound semiconductors industry (e.g. LED, power electronics) uses this eco-friendly technology for reclaiming multiple thin wafers from one thicker wafer or for wafer thinning. SILTECTRAs technology is proven for commonly used semiconductor materials like...

Ingot wafer spalling,grinding replacement (thinning of wafers),wafering,thinning,backside grinding,laser,and slicing

Siltectra gmbh operates in the Semiconductor manufacturing industry.

Siltectra gmbh's revenue is 11m - 100m

Siltectra gmbh has 11 - 50 employees.