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STATS ChipPAC is the worlds leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration...
Semiconductor package assembly,semiconductor test,system-in-package,wafer level packaging,flip chip packaging,and wafer bumping
Stats chippac operates in the Semiconductor manufacturing industry.
Stats chippac's revenue is 101m - 500m
Stats chippac has 1001 - 5000 employees.
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