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STATS ChipPAC

Semiconductor Manufacturing

Specialities :
Semiconductor package assembly
Semiconductor test
System-in-package
Wafer level packaging
Flip chip packaging

+1

revenue-icon Revenue
101M - 500M
funding-icon Total Funding
--
size-icon Size
1001 - 5000

Frequently Asked Questions About STATS ChipPAC

What does Stats chippac do?+

STATS ChipPAC is the worlds leading semiconductor back-end manufacturing and technology services provider, offering a full range of turnkey services that include semiconductor package integration design and characterization, R&D, wafer probe, wafer bumping, package assembly, final test and drop shipment to vendors around the world. Our comprehensive portfolio covers a wide spectrum of semiconductor applications such as mobile, communication, compute, consumer, automotive, and industrial, through advanced wafer-level packaging, 2.5D/3D, System-in-Package, and reliable flip chip and wire bonding technologies. STATS ChipPAC has R&D centers and manufacturing powerhouses in Singapore and Korea, and business operations around the world, providing close technology collaboration...

What are Stats chippac's specialties? +

Semiconductor package assembly,semiconductor test,system-in-package,wafer level packaging,flip chip packaging,and wafer bumping

What is Stats chippac's industry? +

Stats chippac operates in the Semiconductor manufacturing industry.

What is Stats chippac's revenue? +

Stats chippac's revenue is 101m - 500m

What is Stats chippac's company size? +

Stats chippac has 1001 - 5000 employees.

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