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TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporations cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a Cross-edge technology which crosses five leading-edge technologies such as Cutting, Grinding, Polishing, Metalizing, and Bonding. In particular, our processing (technology) are using at the following fields. - Structured glass wafers for MEMS packaging - Glass micro fluidic for Drug discovery and Chemical reaction - Customized heatsinks for Laser Diode and LED We support your design and manufacturing with our Cross-edge technologies
Structured glass wafers for mems packaging,glass micro fulidic for drug discovery and chemical reaction,customized heatsinks for laser diode and led,mems,heatsink,diamond,thermal management,laser,and spacer glass
Tecnisco, ltd operates in the Semiconductors industry.
Tecnisco, ltd's revenue is 11m - 100m
Tecnisco, ltd has 11 - 50 employees.
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